Optimization of the continuity of the aspherical production processes in asphericon s.r.o based on subsurface damage and microroughness analysis

In the paper is presented an analysis and optimization of standardized sub-apertural grinding process used in serial production asphericon s.r.o. The monitored parameter was depth subsurface damage surface microroughness. Tested were five processes, which automatically generated by internal system, for different diamond grit sizes (D151, D91, D64, D30, D15). For evaluation defected layer modified wedge polishing method suitable rotationally symmetrical processes [1]. identifying presence two methods used. Defect detection using optical microscope, as broadly reliable method, standard ISO control to get comparison with common production. microroughness measured a white-light microscope concerning tool amount removed material. Within experiment found most effective two-step uses D91 rough D30 fine grinding. provides very good removal characteristic final 44 µm possible grind out steps 22 total processing time 137 minutes. This timewise best balance 80 minutes long therefore minimize cost. Result around 2 nm Sq fully polished zone already limited process. Using finer not bringing improvement just shortening due lower damage.